SIP一站式设计服务

SIP 设计

1. Component building and Stacked Die Design

2. Substrate Layout

3. FC-BGA,WB-BGA/LGA,PIP,POP,CSP

4. Embedded Active / passive Device Substrate

SIP 设计经验

1. Professional Package Designer

2. Advanced IC Package Design (BGA/CSP/LGA)

3. Multi-chip Module Design

4. 3D Package Design