先进封装与系统集成解决方案
Copper Pillar Bump Flow
Plating Solder Bump Flow
DPS Flow
| Item | 2026-HVM | 2026-NPI | 2027-HVM | 2028-HVM | |
|---|---|---|---|---|---|
| Tech Node | 5nm | 5nm | 4nm | 3nm | |
| Wafer Size(Inch) | 8&12 | 8&12 | 8&12 | 8&12 | |
| Wafer Type | Silicon | Silicon,Glass carrier | Silicon,Glass carrier | Silicon,Glass carrier | |
| Notch Type | Notch | Notch | Notch | Notch | |
| Mask Layer | 3P3M | 4P4M | 4P4M | 5P5M | |
| I/O Pin Count(Die) | 40000 | >45000 | >45000 | >45000 | |
| Bump Structure | Copper Pillar Bump | Cu/Ni/SnAg | Cu/Ni/SnAg | Cu/Ni/SnAg | Cu/Ni/SnAg |
| Plating Solder Bump | Cu/Ni/SnAg Cu/SnAg | Cu/Ni/SnAg Cu/SnAg | Cu/Ni/SnAg Cu/SnAg | Cu/Ni/SnAg Cu/SnAg | |
| Ball Mount | 一 | 一 | Cu/SnAg | Cu/SnAg | |
| Min.Bump Pitch /Min.Bump Size | Copper Pillar Bump | 60/40μm | 50/30μm | 45/25μm | 40/20μm |
| Plating Solder Bump | 100/65 μm | 90/45μm | 90/45μm | 80/40μm | |
| Ball Mount | 一 | 一 | 350/225μm | 300/150μm | |
| Max.Bump Height | Copper Pillar Bump | 110μm | 110μm | 110μm | 110μm |
| Plating Solder Bump | 85μm | 95μm | 95μm | 95μm | |
| RDL Process | RDL Material | Cu,Cu/Ni/Au,Cu/Ni/Pd/Au | Cu,Cu/Ni/Au,Cu/Ni/Pd/Au | Cu,Cu/Ni/Au,Cu/Ni/Pd/Au | Cu,Cu/Ni/Au,Cu/Ni/Pd/Au |
| Min.RDL L/S | 6/6μm | 5/5μm | 4/4μm | 4/4μm | |
| Max. RDL THK | 10 μm | 12 μm | 12μm | 12μm | |